Seasonal thermal storage based on phase change materials (PCMs) require a thermally conductive host because they typically have low thermal conductivities. In this study, tannin-based composite carbon foams were prepared using thermally conductive exfoliated graphite (EG) fillers and pMDI additives. A thermal analyzer measured the thermal conductivity of the samples using the transient plane source (TPS) method. Results showed that the EG-carbon foams and the EG/pDMI-carbon foams showed significantly ...
This study aimed to enhance the thermal and mechanical properties of polyethylene (PE)/boron nitride (BN) composites by manipulating the BN concentrations in the matrix and by applying shear fields in laminating-multiplying elements (LMEs). A thermal constants analyzer measured the thermal conductivity of the PE/BN composites using the transient plane source (TPS) method. Results showed that the thermal conductivity of the composites increased with BN concentration. As well, the ...
The thermal conductivity of nanoporous glass alumina films (NGAFs) were theoretically and experimentally studied in this paper. The thermal conductivity of pristine NGAFs and silver nanowire-infused NGAFs of various pore sizes and porosities were measured with a thermal constants analyser based on the transient plane source (TPS) method. Theoretical and experimental results were consistent with one another, and indicated that the pore radius and porosity of the films influenced thermal ...
In this study, aluminum nitride was treated with silane in an attempt to improve the performance of polyetherimide (PEI) composites. Various properties of the modified AlN/PEI composites were examined including the thermal conductivity by way of a thermal analyzer based on the transient plane source (TPS) method. Results showed that the AlN filler improved dispersion and interface of the matrix which enhanced the thermal conductivity of the PEI composites....
Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled polymer using the transient plane source (TPS) method. Results showed that the thermal conductivity of the particles increased with diameter and aspect ratio, and the ...