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Abstract: Aeronautics safety strongly depends on the Quad Flat Non-Lead (QFN) reliability, whose junction temperature must remain as low as possible during operation. The power must remain below 0.1W, making the QFN64 model most relevant under these operating conditions. This study aims at improving the thermal design and reliability of the QFN64 device for embarked electronics. The thermal conductivities of the materials constituting the device are measured using the Hot Disk TPS 2500. Numerical results are confirmed by thermal and electrical measurements carried out on prototypes for all power-inclination angle combinations.

Reference: The European Physical Journal Plus, 132(8): 1-9

DOI: 10.1140/epjp/i2017-11615-5