Author(s): , , ,

Keywords: , , , , , ,

Abstract: Mechanical flexibility, low cost, and lightweight design are crucial elements for high demand electronic devices and has increased the application of flexible printed circuit board (FPCB). However, FPCB exhibits stress under operating conditions compared to rigid printed circuit board (RPCB), and was studied to investigate the effects of airflow rate and heat on FPCB attached with a ball grid array (BGA) package. Thermal conductivity and specific heat were measured using a Thermal Constants Analyser. Results indicate that heat has significant effects on FPCB’s deflection and stress.

Reference: Microelectronics Reliability (2017), 52: 5-17

DOI: 10.1016/j.microrel.2017.03.022