Category: Transient Plane Source
Author(s): El-oualid Mokhnache, Jun Wang, Mehdi Derradji, Noureddine Ramdani, Wei Dong, Wen-bin Liu, Yu-guang Liu
Keywords: Aluminum nitride, Dielectric Constant, Epoxy, Fillers, Polybenzoxazine, Thermal Conductivity, Transient plane source (TPS) method
Abstract: Compared to traditional epoxy, polybenzoxazine resins have improved thermal, mechanical, and electrical properties. In this article, spherical aluminum nitride (AIN) was studied as a filler in bisphenol A-aniline-based polybenzoxazine (poly(BA-a)). Thermal conductivity was obtained by transient plane source method. Thermal conductivity of each composite gradually increased with enhanced filler amount. Poly(BA-a)/AIN composites also had higher thermal conductivity than systems containing epoxy/AIN.
Reference: Journal of Thermal Analysis and Calorimetry (2016), 126(2): 561-570
DOI: 10.1007/s10973-016-5492-9