Category:

Author(s): , , , , , ,

Keywords: , , , , , ,

Abstract: Compared to traditional epoxy, polybenzoxazine resins have improved thermal, mechanical, and electrical properties. In this article, spherical aluminum nitride (AIN) was studied as a filler in bisphenol A-aniline-based polybenzoxazine (poly(BA-a)). Thermal conductivity was obtained using a Hot Disk TPS 2500S by transient plane source method. Thermal conductivity of each composite gradually increased with enhanced filler amount. Poly(BA-a)/AIN composites also had higher thermal conductivity than systems containing epoxy/AIN.

Reference: Journal of Thermal Analysis and Calorimetry (2016), 126(2): 561-570

DOI: 10.1007/s10973-016-5492-9