Ultrathin boron nitride nanosheets (BNNSs) were prepared at 300°C by a new variable-pressure one-step synthesis. An increase in pressure during the synthesis results in a decreased thickness for the nanosheets, which were all triangular in shape with zig-zag edges. The synthesized nanosheets exhibit high adsorption capacities for the organic dye methylene blue (MB). In addition to these properties, the BN nanosheets can be used as excellent thermal-conducting additives in BN-polymer ...
Vertically-aligned silicon nanowires (SiNWs) are investigated for their use as thermoelectric materials. Using a silver-induced electroless-etching method, SiNWs of varying lengths are prepared, which are expected to have lower thermal conductivities as compared to bulk silicon. A thermal constants analyzer is used to perform the thermal analysis of the SiNWs, and thermal conductivity values are reduced by up to 43%. Theoretical models are then used to explain the quantitative results obtained ...
Natural rubber/graphene (NR/GE) composites were prepared by ultrasonically-assisted latex mining and an in situ reduction process, followed by latex coagulation to obtain the masterbatch. It was determined that this method of preparing the NR/GE composites resulted in an increase in tensile strength when compared to conventional direct mixing. A variety of properties of the composites were investigated, including: thermal conductivity, thermal diffusivity, specific heat, maximum torque, crosslink ...
Polyoxymethylene (POM) composites were prepared by using varying concentrations of copper particles and tested thermally via tribologically via an M-2000 friction and abrasion testing machine. A copper concentration below 10 wt.% didn't affect the thermal properties of the POM composite but using higher concentrations resulted in improved thermal conductivities. Using a copper concentration of 25 wt.% resulted in a thermal conductivity value 35.9% higher than unfilled POM. In addition to the improved thermal ...
Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp), and B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a ...
