Nano-inclusions are thermally conductive particles that improve the thermal conductivity of liquid mediums. In this paper, the thermal properties of Mg2Si were evaluated after the addition of TiO2 nanoparticles. An instrument measured the thermal conductivity of the nanofluid using the transient plane source (TPS) method. Results showed that the thermal conductivity of the nanofluid was the highest at lower temperatures, and did not improve with the addition of the ...
In this paper, natural rubber (NR)/graphene (GE) composites were prepared using an ultrasonically-assisted latex mixing and in situ reduction (ULMR) process. A thermal constants analyzer measured the thermal conductivity of the NR/GE composites using the transient plane source (TPS) method. Results showed that GE had a good thermal conductivity, and can be used as a thermal conductivity enhancer in polymers....
Using the transient plane source (TPS) technique, the effect of addition of pine tree particles to styrene butadiene rubber is studied. Thermal conductivity, thermal diffusivity, specific heat capacity and density were all investigated. Varying amounts of the pine tree filler particles were added to the polymer matrix in order to form composites. Increasing amounts of the pine tree filler resulted in higher thermal conductivity and thermal diffusivity, with decreasing specific ...
For the prediction of thermal conductivity using theoretical models of a composite or mixture of components, the thermal conductivities of the individual components must be known. In this study, the needle probe method was used to measure the thermal conductivity of a mixture of powder and fluid, and using the law of mixtures (Hashin-Shtrikman bounds) the thermal conductivity of the solid phase is estimated. A much simpler method exists though ...
Epoxy resin/silicon carbide (Ep/SiC) composites were prepared by the casting method and subsequently characterized for their mechanical and thermal properties. It was determined that an increasing mass fraction of SiC in the epoxy resin resulted in increasing thermal conductivity of the composites. Using 50 wt.% SiC resulted in a thermal conductivity of 0.7152 W/mK, which is three times that of pure epoxy resin. Mechanical properties peaked with 10 wt.% SiC. ...
