Category: Transient Plane Source
Keywords: composites, Coppe, Copper, Extrusion, Friction Coefficient, M-2000 Friction and Abrasion Testing Machine, particles, polyoxymethylene, Polyoxymethylene (POM) Composites, POM, Thermal Conductivity, Tribological Behavoir
Abstract: Polyoxymethylene (POM) composites were prepared by using varying concentrations of copper particles and tested thermally via the Hot Disk method and tribologically via an M-2000 friction and abrasion testing machine. A copper concentration below 10 wt.% didn't affect the thermal properties of the POM composite but using higher concentrations resulted in improved thermal conductivities. Using a copper concentration of 25 wt.% resulted in a thermal conductivity value 35.9% higher than unfilled POM. In addition to the improved thermal properties, the addition of copper particles resulted in a lower friction coefficient of the POM composite.
Reference: Polymer Engineering and Science, 50, 11 (2010) 2153-2159