Category: Transient Plane Source
Author(s): H. Horibe, H. Nagai, H. Nakano, K. Mitsuishi, K. Sato, K. Watari, T. Shirai, Y. Hotta
Keywords: boron nitride, ceramics, composite materials, Fillers, films, h-BN, hexagonal boron nitride, hexagonal boron nitride (h-BN), plastic, polyimide, Thermal Conductivity
Abstract: The focus of this research was to discover new thermally conductive ceramic/plastic composites for their use in thermal management. In this experiment, the thermal constants analyzer was used to measure the thermal conductivity of composite films containing hexagonal boron nitride particles and polyimide. Upon testing, a thermal conductivity of 7 W/mK with a 60% filler content was noted, as compared to a thermal conductivity of 5 W/mK for the plastic alone. These results shed light on a method for improving the thermal conductivity of ceramic/plastic composites by altering the filler content interfaces.
Reference: Journal of Materials Chemistry, 20, 14 (2010) 2749-2752