As electronic devices approach nanometer scales, heat distribution becomes nonuniform and hot spots begin to form. Integrating graphene into nanoelectronics enhances thermal conductivity and heat flow which mitigates hot spots. In this experiment, large quantities of graphene were produced and thermal conductivity was measured by the transient plane source (TPS) method using an instrument. Results showed that the addition of graphene greatly improved the thermal conductivity of the thermal interface ...
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. ...
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the ...
