Four different cationic surfactants were allowed to adsorb on boron nitride (BN) over the pH range of 5.5 to 8 in separate experiments. The authors talk about the orientation of the surfactant relative to the BN particles. The use of these surfactants has changed the partial ionic surface of BN to a hydrophobic surface, which also led to an increase in thermal conductivity and more favourable mechanical properties.
Different concentrations of boron nitride (BN) were added to novolac resin in order to create a composite and modify the thermal conductivity which increased with increasing BN concentration. An instrument was used for the thermal conductivity measurements. Different size BN particles were also explored. The Maxwell-Eucken model was used to predict values which aligned well with experimental results.
The addition of ceramics, Boron Nitride and Boron-Aluminum Nitride, to an organosoluble polyimide (PI) film was investigated in this research. Test were performed to determine the effect of the addition of ceramics, on the thermal performance of the film, at room temperature. After appropriate treatments, the BN-PI elicited a thermal conductivity of 2.3 W/mK, as compared to the neat polyimide, with a thermal conductivity of 0.13 W/mK. In contrast, due to the porous like nature of the BN+AIN/PI composite film, the thermal conductivity of the film was lower, as compared to the neat polyimide.
Boron Nitride filled epoxy composites are explored on a thermal and mechanical scale within this research article. Researchers took special interest in the effect of filler content, mixing conditions and Boron Nitride agglomerate size, on the thermal conductivity of the composite. Experimental results alluded to an increase in thermal conductivity, as filler content, and mixing speed, time and temperature increased. On the other hand, as the Boron Nitride agglomerate size increased, the thermal conductivity of the composite decreased. As a results, sonication should be used, as opposed to mechanical mixing, to decrease the agglomerate size within the composite and therefore, increase the thermal conductivity.
The purpose of this research was to improve the thermal conductivity of boron-nitride filled epoxy composites. To complete this task, the interfacial adhesion in the composite needed to be improved. This was achieved by employing admicellar polymerization to coat the polystyrene and polymethyl methacrylate, on the boron nitride surface. The results indicated an increase in the thermal conductivity of the composite from 1.5 W/mK, with the use of untreated boron-nitride, to 2.69 W/mK with the use of treated admicellar boron nitride. This increase in thermal conductivity indicates an improvement in the interfacial adhesion between the boron nitride and the epoxy resin.