Category: Transient Plane Source
Author(s): C. Y. Lin, D. H. Kuo, G. S. Liou, J. Y. Cheng, Y. C. Jhou
Keywords: BN, boron nitride, cast method, ceramic composite, ceramics, films, Organosoluble polyimide, Thermal Conductivity
Abstract: The addition of ceramics, Boron Nitride and Boron-Aluminum Nitride, to an organosoluble polyimide (PI) film was investigated in this research. Test were performed to determine the effect of the addition of ceramics, on the thermal performance of the film, at room temperature. After appropriate treatments, the BN-PI elicited a thermal conductivity of 2.3 W/mK, as compared to the neat polyimide, with a thermal conductivity of 0.13 W/mK. In contrast, due to the porous like nature of the BN+AIN/PI composite film, the thermal conductivity of the film was lower, as compared to the neat polyimide.
Reference: Polymer Composites, 34, (2013) pp. 252-258