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Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...
Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal ...
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. ...
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the ...
Through the addition of synthetic graphite particles and carbon fiber to nylon 6,6 in amounts of 10-40 wt.% and 5-40 wt.% respectively, nylon composites were prepared. These composites were then analyzed using the guarded heat flow apparatus to measure through-plane thermal conductivity. Then the transient plane source (TPS) technique was used to measure the through-plane and in-plane thermal conductivities of the composites to compare to the guarded heat flow apparatus. A ...
