Thermal Conductivity Paper Database

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Recommended Papers for: Transient plane source (TPS) method

Total Papers Found: 418

Experimental determination of temperature-dependent thermal conductivity of solid eicosane-based nanostructure-enhanced phase change materials 

Nanoparticle-enhanced phase change materials (NePCMs) are nanofluids that can be used for thermal energy storage when they undergo solid-liquid phase transitions. In this study, a Thermal Constants Analyzer (TPS) measured the thermal conductivity of eicosane-based NePCM samples using the transient plane source (TPS) method. Results showed that thermal conductivity of the solid composites increased with temperature, and eicosane-CuO samples that solidified in an ice-water bath had the lowest thermal conductivities, ...

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The effects of copper and polytetrafluoroethylene (PTFE) on thermal conductivity and tribological behavior of polyoxymethylene (POM) composites 

Polyoxymethylene (POM) is a resistant polymer with wide applications in aerospace, automotives, and biomedicine. However, it falls short when used in the manufacturing of sliding parts. In this study, copper particles and polytetrafluoroethylene (PTFE) powder were incorporated into POM to improve the thermal conductivity of the polymer composite while reducing the friction coefficient. A thermal analyzer was used to measure the thermal conductivity of POM composites using the transient plane ...

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A numerical study on the influence of insulating layer of the sensor on the thermal conductivity measuring accuracy 

In this study, the thermal properties of stainless steel, ceramic, and silica aerogels were numerically calculated and then compared to actual test results. A thermal constants analyser measured the thermal conductivities and thermal diffusivities of the samples using the transient plane source (TPS) method. Results showed that the values generated by the numerical simulation were within ±3% of the TPS method values, which verifies the reliability and accuracy of the numerical ...

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Thermal conductivity enhancement with different fillers for epoxy resin adhesives

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...

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Enhanced thermoelectric properties of Mg2Si by addition of TiO2 nanoparticles 

Nano-inclusions are thermally conductive particles that improve the thermal conductivity of liquid mediums. In this paper, the thermal properties of Mg2Si were evaluated after the addition of TiO2 nanoparticles. An instrument measured the thermal conductivity of the nanofluid using the transient plane source (TPS) method. Results showed that the thermal conductivity of the nanofluid was the highest at lower temperatures, and did not improve with the addition of the ...

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