Chemically modified graphene (CMG) was obtained by combining aminopropyllsobutyl polyhedral oligomeric silsesquioxane (NH2-POSS) and hydrazine monohydrate to functionalize graphene oxide (GO). CMG and polyimide (PI) were combined to create the CMG/PI nanocomposite. The properties of this nanocomposite were obtained using a variety of methods. The thermal conductivity measurements were performed using a TPS instrument by utilizing the transient plane source (TPS) method. It was found that the thermal ...
This article explored polymeric composites and their thermal characteristics, such as their high thermal conductivity and excellent thermal stability. These characteristics are highly desired as they can be widely applied in the electronics, medical, manufacturing, etc., industries. The thermal conductivities were studied using a variety of sources, including the transient plane source (TPS). After conducting several studies on the thermally conductive polymeric composites, it was determined that there were some ...
This article explored the relationship between structure and thermal conductivity in additively manufactured interpenetrating A356/316L stainless steel composites. The thermal conductivities were determined using the transient plane source (TPS) method. The thermal conductivity of a 43 vol% 316L composite was found to be 53 W/mK. This was a much lower value than what was predicted by the rule of mixtures approximation. This was believed to happen because residual porosity degrades ...
This article investigated the effects of silver addition to copper-aluminum (Cu-Al) alloys. These effects were studied by observing the microstructural, thermal, and mechanical properties of the alloy through a variety of methods. A Thermal Constant Analyzer was used to determine the thermal properties (specifically the thermal conductivities) of the alloys by implementing the transient plane source (TPS) method. From this method, it was found that the thermal conductivity and diffusivity ...
The transient plane source (TPS) method was used to measure the thermal conductivity of two hermetic edge-sealing materials by using the Thermal Constants Analyser. Two materials were studied, the Cerasolzer CS186 alloy and the J-B Weld epoxy-steel resin. They were measured, and the TPS technique was validated by obtaining the thermal conductivity values of mild-steel and indium and comparing them to the available literature values. The thermal conductivity was measured ...
