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Abstract: This article investigated the effects of silver addition to copper-aluminum (Cu-Al) alloys. These effects were studied by observing the microstructural, thermal, and mechanical properties of the alloy through a variety of methods. The Hot Disk Thermal Constant Analyzer TPS 1500 was used to determine the thermal properties (specifically the thermal conductivities) of the alloys by implementing the transient plane source (TPS) method. From this method, it was found that the thermal conductivity and diffusivity of Cu-Al alloys increase with the addition of silver content because its addition allows more heat to be conducted in the alloy.

Reference: Journal of Alloys and Compounds (2018), 735:802-812

DOI: 10.1016/j.jallcom.2017.11.176