Category: Transient Plane Source
Author(s): Saim Memon
Abstract: The transient plane source (TPS) method was used to measure the thermal conductivity of two hermetic edge-sealing materials by using the Hot Disk Thermal Constants Analyser TPS 2500s. Two materials were studied, the Cerasolzer CS186 alloy and the J-B Weld epoxy-steel resin. They were measured, and the TPS technique was validated by obtaining the thermal conductivity values of mild-steel and indium and comparing them to the available literature values. The thermal conductivity was measured because it plays a large role in the thermal transmittance (U-value) of the triple vacuum glazing.
Reference: Case Studies in Thermal Engineering (2017), 10:169-178