A novel replication technique for the fabrication of 3D microstructures was developed. A polished silicon wafer was transferred onto an epoxy composite. The thermal properties of the epoxy composite were investigated and compared to those of the pure epoxy. It was determined that not only was the thermal conductivity increased, but the epoxy composite also showed an improvement in mechanical properties over the pure epoxy....
Thermophysical properties of a uranium-6 wt. % zirconium alloy were investigated at high temperatures to evaluate the performance of the alloy as a driver fuel for a liquid-metal cooled fast reactor. Of particular interest to the authors were the coefficient of thermal expansion, the specific heat, and the thermal conductivity of the alloy....
Zr-Cu-Al metallic glasses were formulated with differing compositions to determine their thermophysical properties. It was determined that by decreasing the zirconium content of the metallic glass, the thermal conductivity can be increased. The maximum value of thermal conductivity was found for the metallic glass with a composition of Zr:Cu:Al = 50:39.3:10.7 (at. %). It was found that although the metallic glasses did not crystallize with heat treatment below Tg, they did ...
The physical properties, including thermal conductivity, pore structure, and tapped density, of a novel nanoporous silica material. Thermal conductivity was measured, which determined two values of 0.0284 and 0.0294 W/mK. The materials had a high porosity of 95-97%. The lowest density obtained was 0.077g/cm3. High resolution scanning microscopy and nitrogen physisorption were also used as part of the study....
Inorganic polymers (geopolymers) with varying chemical compositions were subjected to a number of tests in an effort to demonstrate that varying their chemical composition, as well as curing conditions can allow researchers to create geopolymers that fit specific applications based on their microstructure, thermal conductivity, mechanical strength and reliability, and thermal shrinkage behavior....
