Category: Transient Plane Source
Abstract: A novel replication technique for the fabrication of 3D microstructures was developed. A polished silicon wafer was transferred onto an epoxy composite. The thermal properties of the epoxy composite were investigated and compared to those of the pure epoxy. It was determined that not only was the thermal conductivity increased, but the epoxy composite also showed an improvement in mechanical properties over the pure epoxy.
Reference: International Journal of Machine Tools and Manufacture 44 (2004) 147–154