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Abstract: An investigation was conducted to determine the thermal properties of different types of gypsum boards from the USA and Japan. The thermal conductivity and specific heat were determined at room temperature using the transient plane source technique. Measurements were first performed with the paper backing still on the boards, and then once the backing had been removed. Removing the paper resulted in a change in the specific heat, but the thermal conductivity was relatively unchanged after the removal of the paper. The thermal conductivity was also determined as a function of temperature using a slug calorimeter. It was determined that the thermal conductivity increased with increasing temperature for the two gypsum board types from the USA. The boards from Japan were found to crack after the first heating and cooling cycle, and thus the results of thermal conductivity as a function of time were not reported. The specific heat was fairly similar for all samples tested, especially at high temperature. The linear contraction was highly dependent on the sample.

Reference: Proceedings of the Fifth International Conference on Structures in Fire, Singapore, May 28-30, 2008 (pp. 656-665)