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Recommended Papers for: resin

Total Papers Found: 41

Lignin-phenol-formaldehyde aerogels and cryogels

Lignin and phenol are inexpensive naturally derived resources that can be used to produce cost-effective organic gels. This paper aimed to examine the thermal properties of insulative organic aerogels and cryogels made from lignin and phenol. A thermal analyzer (TPS) measured the thermal conductivity of the gels using the transient plane source (TPS) method. Results showed that, as expected, thermal conductivity increased with bulk density. Cryogels were found to be ...

Author(s): , , , , ,

Influence of formulation on the dynamics of preparation of tannin-based foams 

Polyflavenoid tannin-furanic rigid foams have widespread industrial applications. The chemical and physical properties of the five main tannin-based foams are tested and compared in this paper. A TPS instrument measured the thermal conductivity of the tannin-based foams using the transient plane source (TPS) method. Results showed that the tannin foam containing formaldehyde and a low-boiling blowing agent (STD) had the highest thermal conductivity, and the foams without formaldehyde and surfactant (...

Author(s): , ,

Synergetic effect of hybrid boron nitride and multi-walled carbon nanotubes on the thermal conductivity of epoxy composites

Adding metallic nanoparticles to a conventional fluid increases the thermal conductivity of the solution. In this study, flaked boron nitride (BN) and high-aspect-ratio multi-walled carbon nanotubes (MWCNTs) were added to epoxy composites to increase thermal conductivity. A thermal analyser measured the thermal conductivity of the nanofluids using the transient plane source (TPS) method. Results showed that adding a small volume of MWCNT to the epoxy composite significantly improved thermal conductivity ...

Author(s): , , , ,

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...

Author(s): , , ,

Tailoring the structure of cellular vitreous carbon foams

The authors set out to prepare cellular vitreous carbon (CVC) foams with varying thermal and physical properties. This was accomplished by using tannin-based resin modified by different isocyanates in varying amounts. Three different experimental procedures were used to prepare foams with different physical and thermal properties. Physical properties of the foams studied include density, as well as pore volume, pore size and cell diameter. The transient plane source (TPS) technique ...

Author(s): , , , , ,