Thermal Conductivity Paper Database

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Recommended Papers for: resin

Total Papers Found: 25

Thermal conductivity enhancement of epoxy adhesive using graphene sheets as additives

In this study, various filler loadings of thin graphite sheets were added to epoxy adhesives to improve thermal conductivity. Natural graphite powder and graphite nanoflakes were used as reference fillers in the same resin, and the thermal conductivity of each filler was measured with a ...

Author(s): , , ,

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled ...

Author(s): , , ,

Tailoring the structure of cellular vitreous carbon foams

The authors set out to prepare cellular vitreous carbon (CVC) foams with varying thermal and physical properties. This was accomplished by using tannin-based resin modified by different isocyanates in varying amounts. Three different experimental procedures were used to prepare foams with different physical and thermal ...

Author(s): , , , , ,

Effective thermal conductivity of three-phase styrene butadiene composites

The thermal conductivity and diffusivity of a series of three-phase styrene butadiene composites were investigated using the transient plane source (TPS) technique. Both of the series contained a variable amount of natural rubber, as well as variable amounts of silica and clay. The thermal properties ...

Author(s): , , , , ,

Experimental and numerical study of the effective thermal conductivity of nano composites with thermal boundary resistance

Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority ...

Author(s): , , ,