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Author(s): Fazal Ahmad Khalid, Kabeer Raza

Keywords: composite, conventional sintering, copper, densification, diamond, porosity, thermal conductivity, transient plane source (tps)

Abstract: In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. Thermal conductivity was measured at room temperature using a Thermal Constant Analyzer. The addition of diamond particles caused a decrease in the thermal conductivity due to facial air gaps in the composites.

Reference: Journal of Alloys and Compounds (2014), 615: 111-118

DOI: 10.1016/j.jallcom.2014.06.139