Category: Transient Plane Source
Author(s): Fazal Ahmad Khalid, Kabeer Raza
Keywords: composite, Conventional sintering, Copper, Densification, Diamond, porosity, Thermal Conductivity, Transient plane source (TPS)
Abstract: In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. Thermal conductivity was measured at room temperature using a Thermal Constant Analyzer. The addition of diamond particles caused a decrease in the thermal conductivity due to facial air gaps in the composites.
Reference: Journal of Alloys and Compounds (2014), 615: 111-118