This article investigated the effects of silver addition to copper-aluminum (Cu-Al) alloys. These effects were studied by observing the microstructural, thermal, and mechanical properties of the alloy through a variety of methods. A Thermal Constant Analyzer was used to determine the thermal properties (specifically the thermal conductivities) of the alloys by implementing the transient plane source (TPS) method. From this method, it was found that the thermal conductivity and diffusivity ...
Author(s): Asad Naeem Shah, Ghulam Abbas Gohar, Tareq Manzoor
In this study, thermal behaviors of an integrated thermal management system (ITMS) with phase change materials (PCMs) and air conditioning exhaust are examined. To enhance thermal conductivity of the PCM, copper foam and paraffin were added. Thermal conductivity of the composite PCM was measured by a thermal analyzer, based on the transient plane source method....
Author(s): Dongsheng Wena, Hongwei Wuc, Jincheng Tanga, Shang Shib, Yongqi Xiea, Yuming Xinga, Zhongliang Hud
Thermal characteristics of polymer composites are similar to the properties of metal, with the mechanical properties being similar to plastics. Thermal conductivity of a polymer composite depends on geometry of the filler, and interaction and dispersal of the filler within the polymer matrix. In this study, thermal conductivity of copper and Al₂O₃ filled polymer composites were investigated. A Thermal Constant Analyzer was used to measure thermal conductivity of the ...
Author(s): H. S. Tekce
In this study, sintering parameters in conventional pressure-less sintering are analyzed and the effects of uncoated, Cu(Ni)-coated, and Cr-coated diamond particles are compared for their bulk thermal conductivities. Thermal conductivity was measured at room temperature using a Thermal Constant Analyzer. The addition of diamond particles caused a decrease in the thermal conductivity due to facial air gaps in the composites....
Author(s): Fazal Ahmad Khalid, Kabeer Raza
This study aimed to determine the thermal conductivity of gas-filled Metal Organic Framework (MOF) materials. Glass beads were used as the reference material, and nitrogen (N2) and helium (He) were added to the MOF materials. A TPS instrument measured the thermal conductivity of the MOF samples using the Transient Plane Source (TPS) method. Results showed that the MOF materials containing copper had higher thermal conductivities than iron-filled materials, and the ...
Author(s): Jan Georg Henriksen
