Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...
The transient plane source sensors were used to measure thermal conductivity and other thermophysical properties of infrared transparent materials, while under infrared imaging. The infrared imaging provided evidence of temperature uniformity and symmetry, as well as temperature monitoring of the sensor and material being tested. The upgraded version of the original TPS system was used including a bridge circuit, a digital voltmeter, and a data analysis module...
