Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: J. Y. Feng

Total Papers Found: 1

Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on ...

Author(s): , , ,