Category: Transient Plane Source
Author(s): V. Goyal
Keywords: Electronic heat management, electronics heat dissipation, films, Hot spots, Thermal Conductivity, thin films
Abstract: As electronics get smaller and more powerful, the components within them that handle heat dissipation must also evolve. Increasing power density and rising hot spots must be accouted for and handled. In this PhD dissertation, the author studies materials for potential use as heat spreaders or insulators at the nanoscale to understand their thermal properties. Nanostructured superlattices have shown to be highly effective in reducing the thermal conductivity of heat insulators. There is a strong focus on the thermal properties of superthin films for use as highly conductive heat spreaders. The TPS system was used for thermal conductivity measurement. This dissertation helps to give a comprehensive overview of some of the options available for thermal management in the next generation of electronic devices.
Reference: PhD Dissertation, University of California Riverside
DOI: N/A