Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
Through the use of thermally conductive fillers the thermal properties of polystyrene (PS) are improved significantly. The different fillers include: aluminum oxide (Al2O3), magnesium oxide (MgO), B-silicon carbide particles (B-SiCp), and B-silicon carbide whiskers (B-SiCw). The use of PS flakes resulted in higher thermal conductivities than the use of PS particles, and the use of B-silicon carbide whiskers resulted in the most favorable thermal conductivity and resulted in a ...