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Thermal Conductivity Paper Database

Thermtest has compiled the world’s largest thermal conductivity academic paper database. The research paper database is dedicated to the Transient Plane Source (TPS), Transient Hot Wire (THW), Transient Line Source (TLS), and Guarded Heat Flow Meter (GHFM). These techniques offer a wide range of applications, which is represented by more than 1000 papers represented in the database! Search academic papers below:

Recommended Papers for: thermal interface

Total Papers Found: 30

Thermal contact resistance of cured gel polymeric thermal interface material

Thermal interface materials are used to enhance the contact between two pieces of an electronic, to ultimately reduce the temperature and improve performance. This paper researches the contact resistance of curable polymer gels, a thermal interface material (TIMs). These TIM polymer gels have quite different mechanical properties thanks to the rheology of the polymer itself. Alongside physical testing, the researchers proposed a model to predict the thermal contact resistance of ...

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Thermal conductivity enhancement of Ag nanowires on an organic phase change material

Increasing the thermal conductivity of an organic phase change material, all the while maintaining a high phase change enthalpy, is a difficult task. In this study, researchers took 1-tetradecanol/Ag nanowires composites, containing various wt% of Ag nanowires, and tested their thermal conductivities and phase change enthalpies. The results suggest the PCM composite containing 62.73 wt% of Ag nanowires is the most promising candidate for thermal conductivity enhancement of organic phase ...

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Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

The focus of this research was to discover new thermally conductive ceramic/plastic composites for their use in thermal management. In this experiment, the thermal constants analyzer was used to measure the thermal conductivity of composite films containing hexagonal boron nitride particles and polyimide. Upon testing, a thermal conductivity of 7 W/mK with a 60% filler content was noted, as compared to a thermal conductivity of 5 W/mK for the plastic ...

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Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...

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Role of Adsorbing Moieties on Thermal Conductivity and Associated Properties of Nanofluids

In this study, soft sphere surfactants, with varying head group charges and alkyl chain lengths, were investigated for their effects on the thermal conductivity, rheology, density, contact angle and refractive index of nanofluids. It was noted that the thermal conductivity of the ionic surfactant micelles follows the effective medium theory of poor thermal conductance, with interfacial resistance towards infinity. It was also determined that the longer the alkyl chains on ...

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