The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these chips. Desirable features of a high performance TIM include that the material be highly thermally conductive, and that it should have a relatively low viscosity. Companies can spend long periods of time trying to find the amount of filler content ...
This research paper delves into the thermal conductivity monitoring of silicone-based electronic materials with various fillers, using the Transient Plane Source (TPS) technique. Aside from the results, researchers also highlight the main features of the TPS technique: a rapid, precise and non-invasive method for measuring thermal properties of various materials. The results received using the TPS technique match those received using other techniques, however when using the TPS technique 30 tests ...
