The authors report on the use of the newly developed transient plane source (TPS) technique for the measurement of thermal conductivity and thermal diffusivity of insulators, fluids and metals. The paper describes the theory and experimental setup used, including the sensor and how it works. The experimentally obtained values were compared to literature values and showed good agreement....
For the prediction of thermal conductivity using theoretical models of a composite or mixture of components, the thermal conductivities of the individual components must be known. In this study, the needle probe method was used to measure the thermal conductivity of a mixture of powder and fluid, and using the law of mixtures (Hashin-Shtrikman bounds) the thermal conductivity of the solid phase is estimated. A much simpler method exists though ...
The authors used the transient plane source technique for measuring the thermal conductivity, diffusivity and specific heat of highly porous materials. This paper helped to demonstrate that the newly developed TPS technique wasn't just for the measurement of isotropic bulk materials. Different samples of wood composites were analyzed. Once measurements were obtained using the TPS method, they were compared to results obtained theoretically using Verma's model for prediction of thermal ...
Paper that presents a slightly modified version of the early transient plane source technique which allowed the easier measurement of thermal transport properties of solid materials. A series of building materials were tested spanning thermally conductive to thermally insulating materials including extruded polystyrene, polymethyl methacrylate (PMMA), stainless steel and aluminum. This modified method allow the measurement of thermal conductivity values from 0.02 W/mK to 200 W/mK....
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
