Author(s): , , , ,

Keywords: , , , , , ,

Abstract: In this study, some of the most commonly used measurement techniques for thermal conductivity and interfacial contact resistance of bulk and thin film materials are analyzed. For thermal analysis of bulk materials, the laser flash diffusivity method, the steady-state absolute method, comparative technique, and transient plane source (TPS) method are most used. The absolute and comparative technique allow for large sample sizes to be measured, but requires the longest time for data acquisition, compared to the transient technique.

Reference: Journal of Electronic Packaging (2016), 138(4): 1-64

DOI: 10.1115/1.4034605