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Recommended Papers for: Thermal Resistance

Total Papers Found: 11

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites 

Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the ...

Author(s): , , ,

Influence of environmental factors on the adsorption capacity and thermal conductivity of silica nano-porous materials 

Aerogels have a wide range of properties that make them effective thermal insulators. However, these properties are lost when the materials absorb too much water. The goal of this experiment was to determine how temperature and humidity affect the insulative properties of silica nano-porous aerogels. A thermal constants analyzer measured the thermal conductivity of moist silica nano-porous materials using the transient plane source (TPS) method. Results showed that the thermal ...

Author(s): , , , , ,

Analysis of flow and heat transfer characteristics of micro-pin fin heat sink using silver nanofluids

Enhancing heat transfer in miniaturized radiators is an important goal for many researchers. In this study, silver nanofluids were employed to improve the transfer of heat in micro-pin fin heat sinks. A thermal constant analyzer measured the thermal conductivity of the silver nanofluid samples using the transient plane source (TPS) technique. Results showed that the addition of silver nanoparticles to the working fluids improved thermal conductivity, but at high concentrations, ...

Author(s): , , , ,

Characterization of anisotropic and irregularly-shaped materials by high-sensitive thermal conductivity measurements

The transient plane source (TPS) technique has a wide range of applications because of its capability to test solids, liquids, powders, and anisotropic materials over a range of sizes. Thermal properties of thin films and coatings can also be characterized using the TPS method if the samples are placed between the sensor and a bulk background. To minimize errors with the TPS method, use identical materials on each side of ...

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Determination of the Thermal Resistance of the Polymer-Ceramic Interface of Alumina-Filled Polymer Composites

In order to measure the thermal properties of polymer composites that are filled with ceramic powder the researchers created 'macromodels' that accurately modelled the interfacial resistance at each ceramic-polymer boundary. The macromodels were created by spin-coating the polymers onto sapphire wafers....

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