This article explored the relationship between structure and thermal conductivity in additively manufactured interpenetrating A356/316L stainless steel composites. The thermal conductivities were determined using the transient plane source (TPS) method. The thermal conductivity of a 43 vol% 316L composite was found to be 53 W/mK. This was a much lower value than what was predicted by the rule of mixtures approximation. This was believed to happen because residual porosity degrades ...
This article investigated the effects of silver addition to copper-aluminum (Cu-Al) alloys. These effects were studied by observing the microstructural, thermal, and mechanical properties of the alloy through a variety of methods. A Thermal Constant Analyzer was used to determine the thermal properties (specifically the thermal conductivities) of the alloys by implementing the transient plane source (TPS) method. From this method, it was found that the thermal conductivity and diffusivity ...
The transient plane source (TPS) method was used to measure the thermal conductivity of two hermetic edge-sealing materials by using the Thermal Constants Analyser. Two materials were studied, the Cerasolzer CS186 alloy and the J-B Weld epoxy-steel resin. They were measured, and the TPS technique was validated by obtaining the thermal conductivity values of mild-steel and indium and comparing them to the available literature values. The thermal conductivity was measured ...
This article explored the thermal behavior of epoxy nanocomposites containing different types of nanofillers, such as 1-D Multiwall Carbon Nanotubes (MWCNTs) and 2-D predominant shape of Exfoliated Graphite nanoparticles (EG). The thermal conductivity measurements were conducted using a thermal constants analyzer which is based on the transient plane source (TPS) technique. The measurements indicated that better heat conduction is found in epoxy systems loaded with 2-D predominant shape of Exfoliated ...
This article reported on the synthesis, characterization, life cycle assessment (LCA) of nano insulation materials (NIMs) that are made of hollow silica nanospheres (HSNSs). The transient plane source (TPS) technique was used to determine the thermal properties of the HSNSs. The thermal conductivity of the HSNSs is quite low at 0.02 W/mK because thermal conductivity is predominantly size-dependent at the nanometer scale. The HSNS NIMs were found to be comparable ...
