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Recommended Papers for: Electrical Resistivity

Total Papers Found: 14

Enhanced thermoelectric performance of compacted Bi0.5Sb1.5Te3 nanoplatelets with low thermal conductivity

A series of compacted Bi0.5Sb1.5Te3 nanoplatelets are synthesized using hydrothermal methods, followed by cold pressing and sintering at temperatures between 300°C and 380°C. A variety of thermal, mechanical and electrical analyses are then performed on the synthesized nanoplatelets including: TPS technique for thermal conductivity, SEM/TEM/AFM to elucidate the mechanical and physical properties of the nanoplatelets, and the Oxford closed cycle cooler cryostat for measurement of electrical ...

Author(s): , , ,

Improvement of the thermoelectric characteristics of Fe-doped misfit-layered Ca3Co(4-x)Fe(x)O(9+delta) (x=0, 0.05, 0.1, and 0.2)

Measurements were carried out to determine the electrical resistivity, thermal conductivity and Seebeck coefficients of a series of Fe-doped misfit-layered oxides (Ca3Co(4-x)Fe(x)O(9+delta) (x=0, 0.05, 0.1, and 0.2)). The thermal conductivity experiments were carried out using a Thermal Constants Analyzer via the TPS technique. XRD was also used to characterize the Fe-doped oxides. Overall, the transport properties of the Fe-doped oxides were studied and it was found that ...

Author(s): , ,

Transient hot-strip method for measuring thermal conductivity and specific heat of solids and fluids: Second order theory and approximations for short times

Describes how second-order terms are important to the hot-strip method, and should be included in situations where a high-current pulse is being used. The authors determined approximate values for the coefficients of second-order terms....

Author(s): , ,

Thermal Properties of the Hybrid Graphene-Metal NanoMicro-Composites: Applications in Thermal Interface Materials

As electronic devices become smaller, power densities increase and so do hotspot temperatures, leading to a need for materials that can exchange heat better. The materials that facilitate this heat exchange are called thermal interface materials (TIMs). Graphene has been shown to demonstrate superior thermal conductivity and a particular form called few-layer graphene (FLG) was used in this project. A novel TIM was created by the mixing of a silver ...

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