Modified Transient Plane Source MTPS
Glass Ceramic
The thermal characterization of Airloy® X116 Flexible Thin Film (400 µm) samples using the MP-1 Transient Plane Source method.
Thermal Resistance and Thermal Conductivity of Copy Paper and Airloy® X116 samples were measured using the MP-1 Transient Plane Source method.
Measuring the thermal conductivity of the 2 epoxy samples, Loctite® AA H4500 and PRIMA-SOLDER™ (EG8020).
Measuring the thickness of thin film samples with the MP-1 transient thermal resistance module.
Measuring the thermal conductivity, thermal diffusivity, and volumetric specific heat of PEEK thermoplastic in the asymmetric configuration
Accurately measure the thermal conductivity of polymers from solid-state, through a melt, and into the liquid state.
Measuring the thermal conductivity of Pyroceram® at extreme low temperatures with the MP-1 TPS + liquid nitrogen cooling.
Discover the exceptional thermal conductivity of gel and its role in optimizing heat transfer in the electronics industry.
