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Thermally conductive polymers are the most effective and economic methods of removing heat accumulation from microelectronics. In the present study, m-xylylenediamine (MPDA) was used as a curing agent for the epoxy matrix and analyzed for its effect on the thermal conductivity of the composite. Thermal conductivity was measured with a thermal analyzer using the transient plane source (TPS) method. When filling content of the multiwall carbon nanotubes (MWNTs) was 2%wt, ...
Different concentrations of boron nitride (BN) were added to novolac resin in order to create a composite and modify the thermal conductivity which increased with increasing BN concentration. An instrument was used for the thermal conductivity measurements. Different size BN particles were also explored. The Maxwell-Eucken model was used to predict values which aligned well with experimental results....
