Category: Transient Plane Source
Author(s): Dong Wu, Fan Xie, Rui Yang, Shuhua Qi
Keywords: composites, Epoxy resin, Filler, Graphenes, Multiwall carbon nanotubes, Nanotubes, Thermal Conductivity, Transient plane source (TPS) method
Abstract: Thermally conductive polymers are the most effective and economic methods of removing heat accumulation from microelectronics. In the present study, m-xylylenediamine (MPDA) was used as a curing agent for the epoxy matrix and analyzed for its effect on the thermal conductivity of the composite. Thermal conductivity was measured with a thermal analyzer using the transient plane source (TPS) method. When filling content of the multiwall carbon nanotubes (MWNTs) was 2%wt, thermal conductivity of the MWNTs/epoxy composite was approximately six times higher than pure epoxy resin.
Reference: Journal of Applied Polymer Science (2015), 132(2): 41255