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Author(s): , , ,

Keywords: , , , , , , , ,

Abstract: Thermally conductive polymers are the most effective and economic methods of removing heat accumulation from microelectronics. In the present study, m-xylylenediamine (MPDA) was used as a curing agent for the epoxy matrix and analyzed for its effect on the thermal conductivity of the composite. Thermal conductivity was measured with a Hot Disk thermal analyzer using the transient plane source (TPS) method. When filling content of the multiwall carbon nanotubes (MWNTs) was 2%wt, thermal conductivity of the MWNTs/epoxy composite was approximately six times higher than pure epoxy resin.

Reference: Journal of Applied Polymer Science (2015), 132(2): 41255

DOI: 10.1002/APP.41255