Category: Transient Plane Source
Author(s): Andrew A. Wereszczak, Charles N. Volante, Hsin Wang, Phillip J. Farris Jr., Randy H. Wiles, Robert J. Groele, Timothy G. Morrissey
Keywords: Epoxy molding compound (EMC), Fillers, magnesium oxide (MgO), Original equipment manufacturer, Thermal Conductivity, thermal management
Abstract: Despite their tendencies to have low thermal conductivities, epoxy molding compounds (EMCs) are extensively used in automotive applications. In this study, magnesium oxide (MgO) was used as a conductive filler in ECMs to improve the thermal conductivity of the ECMs without altering other important characteristics. A thermal constants analyzer was used to measure the thermal conductivity of the MgO-EMC composites. Ultimately, one of the prepared MgO-EMC compounds was found to contain the perfect amount of MgO filler to improve the thermal conductivity of the material without compromising its rheological control.
Reference: IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 12 (2013) 1994-2005
DOI: 10.1109/TCPMT.2013.2281212