Category: Transient Plane Source
Author(s): J. C. Matayabas Jr., R. S. Prasher
Keywords: gel, heat spreaders, polymer, rheology, semi-analytical model, Thermal Conductivity, thermal contact resistance, thermal cycling, thermal interface materials, TIMs
Abstract: Thermal interface materials are used to enhance the contact between two pieces of an electronic, to ultimately reduce the temperature and improve performance. This paper researches the contact resistance of curable polymer gels, a thermal interface material (TIMs). These TIM polymer gels have quite different mechanical properties thanks to the rheology of the polymer itself. Alongside physical testing, the researchers proposed a model to predict the thermal contact resistance of the TIM. This research was performed to identify and design a possible TIM for use in flip-chip packages, alongside heat spreaders.
Reference: Components and Packing Technology, 27, 4 (2004) 702-709
DOI: 10.1109/TCAPT.2004.838883