Category: Transient Plane Source
Author(s): Brad Canney, Craig Dixon, Michael R. Strong
Keywords: Cooling time, Electronic Interface Materials, Silicone, Thermal Conductivity, TPS Technique
Abstract: The effects of cooling time on the reproducibility and accuracy of thermal conductivity measurements made using a Thermal Constants Analyzer were evaluated. Selected metal alloys and silicone based electronic interface materials were used for the testing. Cooling times of 30, 15, 10, 5, and 1 minute between measurements were selected, and three measurements were made for each cooling time. These tests were also performed at temperatures of 25, 50, and 70ºC to determine if sample temperature had an effect on the optimum cooling time.
Reference: International conference on high-density interconnect and systems packaging, Santa Clara, CA, April 17, 2001, vol. 4428, pp. 262-267.
DOI: N/A