Category: Transient Plane Source
Author(s): K. B. Sharma, Kananbala Sharma, Mahesh Baboo, Manasvi Dixit, N. S. Saxena, Narendra S. Saxena
Keywords: DMA, Dynamic Mechanical Analyzer, Dynamic Mechanical Analyzer (DMA), Elastomers, Polymer composites, Specific Heat, Thermal Conductivity, Thermal Diffusivity, TPS Technique, Transient Plane Source, Transient plane source (TPS) method, Wide Angle X-Ray Scattering
Abstract: The mechanical and thermal properties of blends of cis-polyisoprene (CPI) and trans-polyisoprene (TPI) are investigated and compared to those of the pure elastomers. It was found that the elastic modulus and tensile strength increased with increasing TPI content and that the thermal conductivity, thermal diffusivity, and specific heat of the blends also increased with increasing TPI content. In contrast to this trend, the measured thermal properties of pure TPI were lower in comparison to those of the blends, but still higher than those of pure CPI. The CPI-25/TPI-75 blend was found to have the highest fracture energy, and thus it was determined that this blend is more useful than the other two blends that were studied in applications where high thermal and mechanical properties are required.
Reference: Polymer Bulletin, 66, 5 (2011) 661-672