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Recommended Papers for: Filler

Total Papers Found: 2

High thermal conductive m-xylylenediamine functionalized multiwall carbon nanotubes/epoxy resin composites

Thermally conductive polymers are the most effective and economic methods of removing heat accumulation from microelectronics. In the present study, m-xylylenediamine (MPDA) was used as a curing agent for the epoxy matrix and analyzed for its effect on the thermal conductivity of the composite. Thermal conductivity was measured with a thermal analyzer using the transient plane source (TPS) method. When filling content of the multiwall carbon nanotubes (MWNTs) was 2%wt, ...

Author(s): , , ,

Reaction to fire of an intumescent epoxy resin: Protection mechanisms and synergy

This article investigates the effects of two types of nanoparticles, OctaMethylOligomericSilsesquioxanes (OMPOSS) and carbon nanotubes (CNTs), in a model epoxy resin. Intumescent phosphorous-based flame-retardant (APP) was also incorporated with the CNTs. Thermal conductivity of nanocomposites was measured using a thermal analyser with the transient plane source method. Epoxy with APP and OMPOSS had increasing thermal conductivity below the glass transition temperature (Tg) but slowed above Tg. When APP and CNTs ...

Author(s): , , ,