Category: Transient Plane Source
Author(s): Jing Ding, Jinyue Yan, Weilong Wang, Xiaoxi Yang, Yutang Fang
Keywords: Heat Efficiencies, latent heat, Melting Temperature, pcms, phase change materials, TES, Thermal Conductivity, thermal energy storage
Abstract: Through the addition of different amounts of thermally conducting B-Aluminum nitride powder to polyethylene glycol and silica gel a form-stable phase change material (PCM) is prepared. Using the Thermal Constants Analyzer, the researchers were able to measure the thermal conductivity of the PCMs. Increasing amounts of B-Aluminum nitride powder results in increasing thermal conductivity, but a decrease in the value of the latent heat. Melting temperatures were unaffected by the amount of B-Aluminum nitride powder used in the composite.
Reference: Applied Energy, 86, 7-8 (2009) 1196-1200