Enhanced thermal conductivity and thermal performance of form-stable composite phase change materials by using B-Aluminum nitride

Category: Transient Plane Source

Author(s): Jing Ding, Jinyue Yan, Weilong Wang, Xiaoxi Yang, Yutang Fang

Keywords: heat efficiencies, latent heat, melting temperature, pcms, phase change materials, tes, thermal conductivity, thermal energy storage

Abstract: Through the addition of different amounts of thermally conducting B-Aluminum nitride powder to polyethylene glycol and silica gel a form-stable phase change material (PCM) is prepared. Using the Thermal Constants Analyzer, the researchers were able to measure the thermal conductivity of the PCMs. Increasing amounts of  B-Aluminum nitride powder results in increasing thermal conductivity, but a decrease in the value of the latent heat. Melting temperatures were unaffected by the amount of B-Aluminum nitride powder used in the composite.

Reference: Applied Energy, 86, 7-8 (2009) 1196-1200

DOI: 10.1016/j.apenergy.2008.10.020

Access Article