Phase change materials (PCMs) can be used as heat sinks to manage high temperature fluctuations in electronics. In this paper, a heat sink was generated from a paraffin/expanded graphite composite PCM, and the thermal conductivities of the materials were measured using the transient plane source (TPS) method of the Thermal Analyzer. Results showed that the composite PCM had a significantly higher thermal conductivity than the pure paraffin....
Through the addition of expanded graphite (EG) to polyethylene glycol, the authors were able to enhance the thermal conductivity of the phase change material (PCM). The transient plane source (TPS) technique was used to measure the thermal conductivity of the PCM. The amount of EG affected thermal conductivity, while amount of polyethylene glycol affected latent heat. Through the use of EG, the thermal conductivity was raised fourfold.....
Through the addition of different amounts of thermally conducting B-Aluminum nitride powder to polyethylene glycol and silica gel a form-stable phase change material (PCM) is prepared. Using the Thermal Constants Analyzer, the researchers were able to measure the thermal conductivity of the PCMs. Increasing amounts of B-Aluminum nitride powder results in increasing thermal conductivity, but a decrease in the value of the latent heat. Melting temperatures were unaffected by the ...
