Author(s): , ,

Keywords: , , , , , , , , , , ,

Abstract: A new design was presented of a portable transient hot wire apparatus for measuring the thermal conductivity of solids. The design features a two-wire sensor with silicon layers, compact printed electronic board and a high-tech software suite that utilizes the Finite Elements Method to model heat flow. This methodology is 120x's faster than any previous approach and can reduce the number of simulations required.

Reference: August 2015 International Journal of Thermophysics 36(10-11):3083–3105

DOI: 10.1007/s10765-015-1964-6