Colloid chemistry has been of interest for many years. Researchers have begun to study the effects of metal particles on the stability and thermal properties of cooling liquids. The purpose of this study was to introduce metal particles to a solvent, resulting in a stable and thermally enhanced colloid. To serve as a reducing agent and a particle stabilizer, a cyclodextrin-glucose host-guest complex was synthesized to create aqueous metal colloids. ...
Author(s): Dan Clary
Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...
Author(s): H. Wang, J. Y. Feng, K. M. Ng, X. J. Hu
In this article, researchers studied the effect of particle shape on the thermal conductivity of copper reinforced polymer composites. Short-fiber shaped polyamide composites with filler content ranging from 0 to 30 % were measured, alongside of polyamides containing 0 to 60 % filler, shaped as spheres and plates. When the filler content is low, particles are not interacting with each other, and therefore the thermal conductivity is low. As the filler percentage increases to 10%, an immediate ...
Author(s): D. Kumlutas, H. S. Tekce, I. H. Tavman
This research article proposes the use of a thermal constants analyzer to measure thermal properties of relatively thin samples. Five different metallic samples containing copper, aluminum and brass were used to test the accuracy of the new and improved method. Previously, this method has been used to test the thermal properties of thin metallic sheets, however with the new and improved method, it is possible to measure samples with thicknesses ...
Author(s): E. Karawacki
