The authors examine the melting and crystallization behavior of a polyethylene/boron nitride composite to understand an unexpected exothermic peak when the BN content was greater than 10 wt. %. Based on these observations, an optimal annealing temperature of the composite was investigated to enhance its thermal conductivity. The appearance of the peak was determined to depend on the different nucleated capability of the different BN aggregates in local area. An annealing ...
As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were oriented in a way to achieve a high filler concentration, and the composites were then randomly added to a polyactide matrix. The researchers found that ...
This study aimed to enhance the thermal and mechanical properties of polyethylene (PE)/boron nitride (BN) composites by manipulating the BN concentrations in the matrix and by applying shear fields in laminating-multiplying elements (LMEs). A thermal constants analyzer measured the thermal conductivity of the PE/BN composites using the transient plane source (TPS) method. Results showed that the thermal conductivity of the composites increased with BN concentration. As well, the ...
Adding metallic nanoparticles to a conventional fluid increases the thermal conductivity of the solution. In this study, flaked boron nitride (BN) and high-aspect-ratio multi-walled carbon nanotubes (MWCNTs) were added to epoxy composites to increase thermal conductivity. A thermal analyser measured the thermal conductivity of the nanofluids using the transient plane source (TPS) method. Results showed that adding a small volume of MWCNT to the epoxy composite significantly improved thermal conductivity ...
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...