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Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather the increased ability of these particles to interact with one another. It was found that the hexagonal boron nitride fibers forming networks increased the thermal conductivity when compared with composites containing uniformly dispersed filler particles.
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. It was found that the PEEK/h-BN nanocomposites showed improvements in all of the properties examined when compared to those of PEEK composites, and so it was concluded that PEEK/h-BN shows promise as a nanocomposite polymer for a large variety of applications.
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the electronics industry.
Through the addition of synthetic graphite particles and carbon fiber to nylon 6,6 in amounts of 10-40 wt.% and 5-40 wt.% respectively, nylon composites were prepared. These composites were then analyzed using the guarded heat flow apparatus to measure through-plane thermal conductivity. Then the Transient Plane Source, TPS technique was used to measure the through-plane and in-plane thermal conductivities of the composites to compare to the guarded heat flow apparatus. A finite element analysis model was then created to model the heat transfer trends of 6,6 nylon/carbon composites and was compared to experimental results, with good agreement.
Using the Transient Plane Source, TPS technique, the effect of addition of pine tree particles to styrene butadiene rubber is studied. Thermal conductivity, thermal diffusivity, specific heat capacity and density were all investigated. Varying amounts of the pine tree filler particles were added to the polymer matrix in order to form composites. Increasing amounts of the pine tree filler resulted in higher thermal conductivity and thermal diffusivity, with decreasing specific heat capacity.
