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Two series of nanofluids were prepared by the researchers, using water as the carrier fluid, and Al2O3 and TiO2 as the nanoparticles; up to 6% particle volume fraction was used. The thermal conductivity and thermal diffusivity of the nanofluids were measured using the transient plane source (TPS) technique, and dynamic viscosity was also measured. The amount of nanoparticle volume fraction affected the value of thermal conductivity, but the nanoparticle cluster ...
Al2O3 nanofluids were prepared with 2, 3, and 4 vol% Al2O3 nanoparticles in water for use as a coolant in plate heat exchangers. Using the transient plane source (TPS) technique, the thermophysical properties of the nanofluids were studied. Correlation equations were obtained for Nusselt number and the friction factor for the nanofluids and water. Less nanofluid is required to produce the same amount of cooling than water....
Through the addition of copper oxide nanoparticles to cyclohexane in varying concentrations, a series of nano-enhanced phase change materials (NePCM) were prepared. The transient plane source (TPS) technique was used to characterize the NePCM at multiple temperatures. It was determined experimentally that increasing concentrations of nanoparticles in the liquid phase resulted in increasing thermal conductivity, but increasing nanoparticle concentration in the solid phase didn't have the same effect.Unidirectional freezing ...
Surfactants are often used in nanofluids to help improve dispersion and prevent aggregation of the resident nanoparticles. In this study, the researchers used the transient plane source (TPS) technique to measure the thermal conductivity of a variety of nanofluids with different surfactants of varying concentrations, at different temperatures and pH values. For surfactants, thermal conductivity stabilizes after the addition of a certain concentration of that surfactant. Strongly acidic and alkaline ...
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
