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Recommended Papers for: thermal transport properties

Total Papers Found: 19

Thermal conductivity measurement of molten indium antimonide in short-duration microgravity 

In this study, a sensor measured the thermal conductivity of molten indium antimonide (InSb) using the transient plane source (TPS) method. The measurements were taken during a 10 m short-duration microgravity drop. Results showed that the thermal conductivities of molten InSb were higher in normal gravity than in microgravity....

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Green, formaldehyde-free, foams for thermal insulation

This paper presents the idea of flavonoid foams that are manufactured from natural resources rather than formaldehyde-containing tannin-based foams. A TPS instrument measured the thermal conductivity of the foams using the transient plane source (TPS) technique. Results show that the flavonoid foams are a better choice than tannin-based foams because they have a lower thermal conductivity which makes them more insulative and fire resistant, and they do not release toxic ...

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On the use of transient plane source sensors for studying materials with direction dependent properties 

The Transient Plane Source (TPS) Technique measures the thermal conductivity, thermal diffusivity, and specific heat of solids and liquids. An electrically conducting double spiral nickel sensor pulses a current through a sample which increases its temperature, while simultaneously recording the length of time it took for the sample to heat up. This study, researchers tested the thermal properties of various materials and determined that anisotropy must be considered when these ...

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A numerical study on the influence of insulating layer of the sensor on the thermal conductivity measuring accuracy 

In this study, the thermal properties of stainless steel, ceramic, and silica aerogels were numerically calculated and then compared to actual test results. A thermal constants analyser measured the thermal conductivities and thermal diffusivities of the samples using the transient plane source (TPS) method. Results showed that the values generated by the numerical simulation were within ±3% of the TPS method values, which verifies the reliability and accuracy of the numerical ...

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Thermal conductivity enhancement with different fillers for epoxy resin adhesives

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...

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